Pgdm Manufacturing Operations Manager - Penang, Malaysia - INTEL

INTEL

Verified Company

Penang, Malaysia

2 weeks ago

Posted by:

Siti Tan

beBee Recruiter

Description

Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors.

The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, leveraging Intel's Advanced Packaging technology portfolio to deliver leadership products.

To enable this ramp, DMO is building an Advanced Packaging manufacturing facility in Malaysia, increasing its investment in this region which has been a critical part of Intel's supply chain for over five decades.

Join the Intel Malaysia Advanced Packaging team where you will be instrumental in developing and ramping some of Intel's newest Advanced Packaging technologies and help us realize Intel's vision to create and extend computing technology to connect and enrich the lives of every person on Earth.

Responsibilities will include, but are not limited to:

Manages and leads a team of technicians overseeing operations, equipment maintenance, and repair in manufacturing facilities.
Owns safety, quality, scheduling, and conflict resolution amongst staff and other stakeholders and assists in resolving operational, safety, and security issues.
Oversees flow of work through factories and streamlining processes and operations between groups and divisions.
Establishes tactical plans to ensure production schedules are met within established quality and cost objectives.
Ensures optimum total area performance in terms of safety, quality, output, and cost through staffing training development and retention of the group.
Coordinate multiple functions within a manufacturing facility, establishing strategic toolset plans, including training capability to ensure production schedules are met within established time, quality, and cost objectives.
Understands scheduled and unscheduled equipment maintenance, repair, recovery, troubleshooting, tool quality, and tool run rate.
Works with engineering teams to solve problems impacting factory operations/health.
Ensures effective employee staffing including workstation assignment, shift rotations, and PTO requests.
Owns shift schedule including workstation assignments/rotations, employee training, employee vacations, employee breaks, overtime assignment, backup for absent employees, and shift rotations.
Establishes training plans for direct reports and monitor training performance against schedule to assure shift team has skills needed to sustain production.
Regularly reviews staffing certification levels that are tied to wafer ramp levels and ensures performance required number of certified individuals for each ramp threshold.
Develops long term strategies for manufacturing operations capabilities to support future requirements.
Drives results by inspiring people, role modelling Intel values, developing the capabilities of others, and ensuring a productive work environment.
Be part of the pioneer team in leading ramping Intel's latest Advanced Packaging technologies from process startup to high volume manufacturing.
Interacting with partner factories worldwide to transfer new equipment/processes, maintain CE (copy exactly) parameters, best known method learnings and drive strategic improvement projects.

Qualifications:

BS/3+ years or MS/2+ years or PHD in Chemical/ Mechanical/ Mechatronic/ Microelectronic/ Electrical Engineering or equivalent, with industry experiences in semiconductor field.
3+ years of experience with manufacturing supervisory and/or management experience in a High-Volume Manufacturing in semiconductor field.
Excellent communication skills with a high tolerance for ambiguous and dynamic situations.
Minimum 5+ years of experience in Lithography module manufacturing environment.
Understanding of overall wafer fabrication process flow, technology, and theory of constraint management.
Strong technical/ engineering background in wafer fabrication and proven track record in technical problem solving and able to provide solution to overcome complex technical challenges.
Ability to coordinate, lead, and develop teams (improvement, preventative, corrective, and sustaining).
Manage the achievement of area maintenance and output goals while exercising good judgment on a variety of problem situations and sustaining the values of safety and quality.
People interactive skills with all organization levels in a diverse environment. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Inside this Business Group:

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.

Employees i