Lila Shini

The position is for Package Module Development Engineer for Thermal Compression Bonding die attach module in Advanced Packaging Technology and Manufacturing - Technology Development (APTM-TD) as part of TD in Asia initiative. · Selects and develops material and equipment for the ...

This role involves following technical trends of optical module package design and proposing innovative concepts for process development. The ideal candidate will have experience in semiconductors packaging (die attach / wire bonding / flip-chip / optical alignment), optics/photo ...

Dexcom is a pioneer in continuous glucose monitoring. We are driven by ambitious people who listen, serve with integrity and think big. The opportunity to improve health on a global scale stands before us. · Partner with IT Information Security team to automate backend operation ...