Yok jing Ong

A proactive year 2 student MEng student at the University of Nottingham with a keen interest in semiconductors, FGPA, Robotics, Automation, IoT, as well as software and programming. I enjoy working on new challenges and like to step out of my comfort zone.

1. Heraeus Nexensos Malaysia SDN.BHD. -- Engineering Intern (Jun 2022- Sep 2022)( Year 1) • Failure Mode Analysis: Develop PFMEA for current products and review current procedure to increase yield, reduce defects and further improvement. Support in the investigation of several failure mechanisms of splicing issues and the team managed to reduce to 5% from 15%. • Control plan: Review and develop new control plansfor current products for the new layout to improve the yield of the products and reduce the defects and support in the upcoming customer audit. Optimized and streamlined the process by performing workflow analysis support to enhance productivity improvement and efficiency. • Preventive maintenance & calibration: Develop new SOPs for data collection with various types of ovens and develop a new periodic checklist for various types of ovens. Complete the Sop and checklist for the different types of ovens. • Production line Transfer: Support in the production line qualification run. Data collection and data analysis in the qualification run and worked closely with the QA team to investigate the defects. 2. Intel-University VLSI Bootcamp- Introduction to VLSI • Participated in Intel-University Bootcamp that introduce VSLI. • Propose a Soc Design related to the system on chip (Smart Kebun) 3. Microsoft Apps & Power automate workshop • Participated in Microsoft Apps& Power automate workshop. • Basic knowledge on Microsoft Power Apps& Power Automate

University of Nottingham | Malaysia

MEng Electrical and Electronics Engineering

Year 1: CGPA 4.0