About Yung Siang Lim:
Experienced in semiconductor manufacturing from Micron Semiconductor, NXP Semiconductor.
Experience
Micron Semiconductor Asia Pte. Ltd. > Process Equipment Engineer
- Collaborated with Production, Equipment, Shift Engineering, Process Integration and other Process Areas in day-to-day tasks.
- Abnormal analysis, tools health monitoring and improvement through statistical analysis such as SPC chart.
- Carried out preventative maintenance (PM) and corrective maintenance (CM) on the tools to maintain tools uptime.
- Responded and troubleshoot issues or faults at the tools side.
NXP Semiconductors Malaysia Sdn. Bhd. > Process Engineer Intern
- Familiarized with semiconductor manufacturing particularly on wire bonding processes within a time period of 11 weeks.
- Prepared and carried out quality checks on test samples using HISOMET, SEM & EDX for FMEA.
- Identified, collected and performed data analysis on test data to ensure the desired benchmark is always followed.
- Carried out DOE in evaluating new capillary tool with an extensive tool life and completed with an anticipated usage of 3 times greater than current tool which lead to overall increased productivity.
Education
Universiti Teknologi Malaysia > Bachelor of Engineering, Mechanical Engineering > CGPA: 3.94/4
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Choon Siang Wong
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