Yung Siang Lim

Experienced in semiconductor manufacturing from Micron Semiconductor, NXP Semiconductor. 

 Micron Semiconductor Asia Pte. Ltd. > Process Equipment Engineer

• Collaborated with Production, Equipment, Shift Engineering, Process Integration and other Process Areas in day-to-day tasks.
• Abnormal analysis, tools health monitoring and improvement through statistical analysis such as SPC chart.
• Carried out preventative maintenance (PM) and corrective maintenance (CM) on the tools to maintain tools uptime.
• Responded and troubleshoot issues or faults at the tools side.

NXP Semiconductors Malaysia Sdn. Bhd. > Process Engineer Intern

• Familiarized with semiconductor manufacturing particularly on wire bonding processes within a time period of 11 weeks.
• Prepared and carried out quality checks on test samples using HISOMET, SEM & EDX for FMEA.
• Identified, collected and performed data analysis on test data to ensure the desired benchmark is always followed.
• Carried out DOE in evaluating new capillary tool with an extensive tool life and completed with an anticipated usage of 3 times greater than current tool which lead to overall increased productivity.
   

Universiti Teknologi Malaysia > Bachelor of Engineering, Mechanical Engineering > CGPA: 3.94/4