Senior/Staff Assembly Equipment Engineer - Malaysia - Micron

Description

Our Vision:

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever.

JR46612 Senior/Staff Assembly Equipment Engineer (Wire Bond/Die Attach)

As a Staff Equipment Engineer, you will lead a group of engineers responsible for the equipment used in the manufacturing process. You will ensure that the equipment is installed, modified, upgraded, and maintained accurately to meet the production requirements and quality standards. You will also analyze the equipment performance and reliability data to identify and implement improvement opportunities. You will work with vendors to qualify alternative sources of equipment and reduce costs, handle the equipment risk efficiently, and proactively develop new capabilities to meet future needs.

Responsibilities and Tasks:

1. Implement a preventive/predictive maintenance program.
2. Develop equipment maintenance specifications.
3. Monitor equipment performance key indicators and be responsible for meeting expectations.
4. Provide vital production support.
5. Establish a spare inventory system for key equipment.
6. Supervise spare cost and drive down liabilities of spare inventories.
7. Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy.
8. Identify the key cost drivers and work on cost-reduction programs.
9. Define, develop, and maintain equipment capabilities, strategy, and roadmap.
10. Maintaining a matrix of equipment capabilities and constraints.
11. Work with equipment suppliers to develop new material/capabilities.
12. Regularly conduct equipment benchmarking exercise.
13. Work with Package Development team to establish production capabilities for new products.

Requirements:

1. Master / Degree or equivalent experience in Mechanical, Mechatronics, Electrical & Electronics or related Engineering.
2. Excellent interpersonal, communication, and leadership skills with a very positive demeanor toward working as a team.
3. In-depth knowledge and extensive experience with DA/WB.
4. Serves as a domain expert within the technical field.
5. Working experience >8 years in Die Bonder and Wire Bonder processes.
6. Experience with multi-stack above process challenge.
7. APC data analytics knowhow.
8. Experience with team leadership or supervising senior/junior engineers and technicians.
9. Ability to work independently with a minimum of day-to-day supervision, in a multi-functional team and under the pressure of multiple priorities, for example with NPI and process teams.
10. Past white paper/technical paper or active patents will be an added advantage.