Equipment Engineer - Perai, Malaysia - Micron

    Micron
    Micron background
    Description

    Our vision is to transform how the world uses information to enrich life for all.

    Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

    JR45427 Equipment Engineer

    Equipment Engineer

    Job Description:

    As an Equipment Engineer for Module/SSD Assembly, you will be responsible for developing, evaluating, and improving Module/SSD Assembly related equipment, coordinating equipment procurement, qualifying, and implementing new FOAK equipment. Provide daily engineering support to meet department KPI and overall business targets. You will be working closely with cross-functional teams, including Process, manufacturing, NPI, IT and suppliers to maintain or improve the process and equipment.

    Responsibility and Tasks:

    Evaluate and Improve Manufacturing Processes and Equipment

  • Maintain in-depth knowledge of equipment, process, and system
  • Improve process and/or equipment performance
  • Perform containment for process and equipment deviations
  • Determine root cause
  • Implement corrective action
  • Manage and coordinate preventive and predictive maintenance.
  • Design equipment components (Improve equipment capability by exploring innovative ideas/concepts and implementing equipment).
  • Identify & maintain spare parts
  • Setup and buyoff for new equipment
  • Perform cost reduction projects.
  • Evaluate Future Process and Equipment

  • Collaborate with supplier on the design of new equipment/tooling's
  • Evaluate pertinent technology and engineering advancements relating to equipment and processes
  • Build and maintain effective relationships with suppliers
  • Evaluate new tooling material for cost saving effort
  • Coordinate Training Requirements and Conduct Training

  • Develop, or coordinate development of training materials
  • Coordinate and conduct technical training.
  • Train and mentor others
  • Requirements:

  • Minimum of a bachelor's degree in Engineering. Mechanical/Mechatronics Engineering is preferred
  • Min 5 years' experience in HVM environment specifically in SMT, Semiconductor and electronics. (Exclude for NCG program).
  • Module/SSD manufacturing process and technologies experience is preferred.
  • Familiar with SPC, root cause analysis techniques, FMEA, QC tools, KTDA
  • Experience in 3D CAD software
  • Knowledge on Windows, network, database & pc, hardware is preferred
  • Experience in equipment maintenance and troubleshooting skills is preferred