EPE Process Engineer - Johor Bahru, Malaysia - Micron

    Micron
    Micron Johor Bahru, Malaysia

    1 week ago

    Micron background
    Description

    Our vision is to transform how the world uses information to enrich life for all.

    Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

    JR42657 EPE Process Engineer

    As a Post Encapsulating Process Engineer you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

    Job Responsibilities :

  • Execute smooth transfer of new products and packages from NPI to HVM site.
  • Validate and document baseline the POR, TOR and BOM for the transferred products and packages
  • Identify, diagnose and resolve assembly process related problems
  • Participate in continuous yield improvement and cost reduction activities
  • Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
  • Support SPC/FDC/RMS/APC
  • Support site to site portability
  • Manage / audit material suppliers to achieve quality, cost and risk management objectives
  • Support internal and external audits

    • Requirements:

  • Bachelor's or degree in Electronic, Mechanical, Mechatronic or related Engineering
  • Experience in Assembly packaging or Semiconductor manufacturing background will be an added advantage
  • Familiar with Failure Mode Effects Analysis (FMEA), Statistical Process Control (SPC) and problem-solving skills
  • Self-motivated, possess initiative and ability to work independently
  • Team player with good communication and interpersonal skills