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- Responsible for package design tasks in OSAT segment which specialsingin Power Module construction and design of SiC and IGBT products for Automotive.
- Give technical guidance within OSAT in development and pre-development of new package technologies, processes and materials.
- Drive problem solving, hypothesis prioritization, using clear systematic approach to draw conclusions out of analysis and derives lesson learned.
- Drive subcon partners to ensure projects are managed within time, budget and scope of project.
- Be the main contact person within OSAT Development focusing in package development, technology integration and delivering solutions in highly complex FE/BE technology interactions.
- Bachelor's/Master's Degree in Engineering or Physics.
- Excellent technical knowledge of BE processes and materials in Power Module packages and interaction to the different functions (interaction of BOM, package construction, design rules and process).
- Good understanding of Automotive quality requirements and standards.
- Strong analytical skills, ability to deal with conflict and ambiguity.
- Strong communication and stakeholder management skills across all levels.
- Good knowledge of technical topics and strong in people interpersonal skills and experience in Subcon management.
Senior Staff Engineer Package Design Development - Malaysia, Ipoh - Infineon Technologies (Malaysia) Sdn Bhd
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Job Description
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What we offer you in Melaka
Melaka is our biggest production site wordwide with more than 7000 employees.