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- Wire Bond expert, responsible to achieve robust and auto-pilot processes
- Sustains and continuously improves qualified technologies in volume production with regards to stability, quality, productivity and yield.
- Supports development of new technologies and ensures smooth take-over into volume production and integration into manufacturing environment.
- Accountable and drive for 8D closure of FAR, MRB, DDM and SDCAR
- Leading and participating in yield & quality improvement and cost reduction activities
- As a technical expert in new material, process and method qualification
- Bachelor degree in Electronic, Mechanical or related Engineering
- More than3 years related experience in Assembly packaging or Semiconductor manufacturing background
- Experience inWire Bond Process
- Data Analysis (Statistical methods, data mining, etc)
- First level reliability (Knowledge of various failure modes, knowledge of application and respective reliability requirements and test standards)
- FSI (Front Side Interconnect)
Senior Engineer Unit Process Engineering Wire Bond - Melaka, Malaysia - Infineon Technologies (Malaysia) Sdn Bhd
Description
Job Description
In your new role you will:Your Profile
You are best equipped for this task if you have:Benefits
What we offer you in Melaka
Melaka is our biggest production site wordwide with more than 7000 employees.