Principal Engineer Process Wire Bond - Melaka, Malaysia - Infineon Technologies (Malaysia) Sdn Bhd

Infineon Technologies (Malaysia) Sdn Bhd Melaka, Malaysia

3 days ago

Full time

In your new role you will:

To sustain, improve the process in order to deliver products to customers at committed functionality, reliability, time, volume and cost.
Ensure compliance of control plan deployment and quality controls are met understanding of key parameters definition and controls.
Knowledge in FOL process engineering specializing in Wire Bond.

Your Profile

You are best equipped for this task if you have:

Bachelor's degree in Mechanical/ Electrical / Electronics /Microelectronics / Mechatronics / Materials Science / Semiconductor Technology
More than10 years related experience in FOL Process Engineering or in Semiconductor Assembly Manufacturing background.
Statistical data analysis, analytical and problem solving skills.
Ability to anticipate issues and challenges and resolving them quickly
Expert in prosses knowledge and skills in manufacturing process &some equipment knowledge.
Systematic Problem Solving methodology e.g. 8D, DMAIC, Process Mapping, FTA, Fish Bond

Benefits

What we offer you in Melaka

Melaka is our biggest production site wordwide with more than 7000 employees.

Staff Engineer Process Wire Bond