Jobs

    Senior/Staff Assembly Equipment Engineer - Malaysia - Micron

    Micron
    Micron Malaysia

    7 hours ago

    Micron background
    Full time
    Description

    Senior/Staff Assembly Equipment Engineer (Wire Bond/Die Attach)

    Our goal is to revolutionize how information is utilized to enhance life for everyone. Micron Technology is a global pioneer in developing cutting-edge memory and storage solutions that speed up the conversion of data into knowledge, motivating individuals worldwide to acquire knowledge, communicate, and progress more rapidly than ever.

    Responsibilities and Tasks:

    • Implementing a proactive/preventive maintenance program
    • Creating equipment maintenance specifications
    • Monitoring key performance indicators of equipment performance and ensuring expectations are met
    • Providing crucial production support
    • Establishing a spare inventory system for essential equipment
    • Overseeing spare costs and reducing inventory liabilities
    • Collaborating with Purchasing to identify vital suppliers and devise a secondary sourcing strategy
    • Pinpointing significant cost drivers and initiating cost-cutting initiatives
    • Defining, developing, and managing equipment capabilities, strategy, and future plans
    • Maintaining a matrix of equipment capabilities and limitations
    • Engaging with equipment suppliers to introduce new materials/capabilities
    • Regularly conducting equipment benchmarking exercises
    • Cooperating with the Package Development team to establish production capacities for new products

    Requirements:

    • Master's Degree or equivalent in Mechanical, Mechatronics, Electrical & Electronics, or related Engineering fields
    • Outstanding interpersonal, communication, and leadership skills with a highly collaborative approach
    • Comprehensive knowledge and extensive experience with DA/WB processes
    • Serving as a subject matter expert in the technical domain
    • Over 8 years of work experience in Die Bonder and Wire Bonder processes
    • Experience dealing with challenges in multi-stack processes
    • Proficiency in APC data analytics
    • Prior experience in leading teams or supervising senior/junior engineers and technicians
    • Ability to work autonomously with minimal supervision in a cross-functional team environment and under the demands of various priorities, such as with NPI and process teams
    • Previous white paper/technical paper publications or active patents would be advantageous

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