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    Staff Assembly Equipment Engineer - Simpang Ampat, Malaysia - Micron

    Micron
    Micron Simpang Ampat, Malaysia

    Found in: Talent MY C2 - 2 days ago

    Micron background
    Description

    Our vision is to transform how the world uses information to enrich life for all.

    Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

    JR44225 Staff Assembly Equipment EngineerAs a CR1 Staff Equipment Engineer, you will be oversees the installation, modification, upgrade and maintenance of manufacturing equipment including studies equipment performance and reliability to ensure production equipment is in control and quality of product is meeting expectation; sustaining and improving key performance indices of the equipment through continuous improvement activities; reducing cost through qualifying 2nd source; ensuring effective and efficient equipment risk management strategy; continuous develop new capabilities ahead of needs.Responsibilities and Tasks:
  • Implement Preventive/Predictive maintenance program
  • Develop equipment maintenance specification
  • Monitor equipment performance key indicators and responsible to meet expectation
  • Provide necessary production support
  • Establish spare inventory system for key equipment
  • Monitor spare cost and drive down liabilities of spare inventories
  • Work with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
  • Identify the key cost drivers and work on cost reduction programs
  • Define, develop and maintain equipment capabilities, strategy and roadmap
  • Maintaining a matrix on equipment capabilities and constraints
  • Work with equipment suppliers to develop new material / capabilities
  • Regularly conduct equipment benchmarking exercise
  • Work with equipment suppliers to develop new capability
  • Work with Package Development team to establish production capabilities for new products
  • Requirements:
  • Master / Degree in Mechanical, Mechatronics, Electrical & Electronics or related Engineering
  • Minimum 3 years of working experience in semiconductor industry.
  • Knowledge in Wafer Sawing, laser Grove, Backgrinding/Thinning, Stealth Dicing will be added advantages.
  • Excellent interpersonal, communication and leadership skill with an extremely positive attitude towards working as a team.
  • Broad technical knowledge in problem solving analytical skill & lead an engineering team through innovative process implementation (FMEA, DOE, FDC/APC, DATA ANALYSIS)
  • Self-motivated, possess initiative and ability to work independently
  • Team player with good communication and interpersonal skills

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