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    Principal Engineer Development Package Innovation - Melaka, Malaysia - Infineon Technologies (Malaysia) Sdn Bhd

    Infineon Technologies (Malaysia) Sdn Bhd
    Default job background
    Full time
    Description

    Job Description

    In your new role you will:
    • Observe and proactively act on trends in Package Innovation by having a sense of urgency for upcoming innovation and supporting feasibility studies.
    • Facilitate and encourage innovation within his/her field of expertise, coachand challenge new ideas, actively balance risks and opportunities, and drive decisions.
    • Contribute to Functional Area business value, roadmap/standards definition with industry partners, and development and implementation of strategy within his/her field of expertise.
    • Contribute to the IP strategy in his/her field of expertise providing exploitation options, fosteringpatent creation, and Infineon's reputation through publications and speeches.
    • Responsible fortechnical decision-making for BL/Functional Area and takes responsibility for implementation.
    • Actively scout for new packaging technologies and keep in touch with package development at competitors/subcons.
    • Drive innovation and pre-development activities within the package platform.
    • Be the main personand technical consultant/coach for all questions and discussions regarding packaging innovation.
    • Collaboratively creates and supports innovative ideas in his/her field of expertise › Investigates new ideas, considers alternatives, and drives active risk management.
    • Represents technical competence of Package Innovation. Has a measurable impact on BL/Functions business value and strategy Implementation.

    Your Profile

    You are best equipped for this task if you have:
    • Bachelor's Degree in Engineering inSemiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, and Electronics Physics.
    • At least 9 years of relevant working experience in an IC/semiconductor environment.
    • Background in Semiconductor Packaging, Assembly and Test.
    • Process and Equipment Engineering knowledge.
    • Semiconductors Products application knowledge.
    • Analytical and Problem-Solving skills.
    • AutoCAD and 3D drafting preferred.
    • Material science knowleges.
    • Package requirement and qualification knowledges

    Benefits

    What we offer you in Melaka

    Melaka is our biggest production site wordwide with more than 7000 employees.


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