- Perform root cause analysis for ICO/FAR related defects, evaluate defect prevention methodologies in relevant unit processes
- Benchmark and perform interconnect-related process analysis for existing and new technologies to achieve maximum process capability against benchmark and work with UPS and BE engineering to eliminate defects and drive continuous improvement.
- Integration technical support in new technology transfer projects.
- Development of innovative processes and process characterization methodologies for existing and new interconnect technologies.
- Design & execute experiments and perform technical analysis & documentation on the results.
- Assessment of process changes and process change management
- Interface between business units, process engineering, frontend and backend sites, reliability engineering and production
- Interact and communicate effectively in cross functional teams e.g. in 8D teams and taskforces.
- PhD/Master/ Degree in Physics/Chemistry/Material Science/Mechanical Engineering/Electronics Engineering or equivalent
- At least 5 years of in-depth knowledge of characterization methodology on packaging assembly materials and processes
- Good knowledge in material science, metallurgy, polymer science, advanced failure analysis (fractures, intermetallic & microstructure, interfacial adhesion, surface & chemical analysis, outgassing, stress)
- Good technical knowledge in chip-to-package interactions with regards to interconnect reliability, materials and processes (wafer saw, die attach, wire bonding, flip chip bonding, molding. All-round expertise in FOL processes preferred)
- Good experience in problem solving methodologies and design of experiment.
- Good interpersonal skills, analytical and leadership skills & a good team player.
- Must be a self-starter who can work both independently and in groups across different site functional teams.
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Infineon Technologies Kulim, MalaysiaI · n your new role you will: · - rovide key support to Process Integration & Product Engineers on Inline / · PCM/Functional Test / yield data for process improvement to meet quality and yield targets. · - upport PI & PTE in SPC and DoE task. · - ork on lot history checks, common ...
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Infineon Technologies (Malaysia) Sdn Bhd Kulim, Malaysia Full timeJob Description · In your new role you will: · . Provide key support to Process Integration & Product Engineers on Inline · / PCM / Functional Test / yield data for process improvement to meet quality and yield targets. · . Support PI & PTE in SPC and DoE task. · . Work on lot hi ...
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Infineon Technologies (Malaysia) Sdn Bhd Kulim, Malaysia Full timeJob Description · In your new role you will:Lead and manage a team of Process Integration and Product Engineering engineers to achieve organization's objectives in terms of yield, quality, stability and cost in high volume Frontend (FE) Wafer Fabrication environment · Support New ...
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Engineer Process Integration - Kulim, Malaysia - Infineon Technologies (Malaysia) Sdn Bhd
Description
Job Description
In your new role you will:Your Profile
You are best equipped for this task if you have:Benefits
What we offer you in Kulim
In our wafer production in Kulim we are producing more than wafer each month.