Principal Engineer, Package Integration Engineering - Simpang Ampat, Malaysia - Western Digital

Western Digital Simpang Ampat, Malaysia

5 days ago

Full time

Description

Job Description

You will work as SSD (Solid State Drive) package integration engineer in packaging engineering group. Leads new SSD product development from concept design and qualification to mass production. Generate innovative product concepts and transform them into tangible, market-ready products. Work closely with global functional teams in US, India, South Korea, and Israel, review feasibility design drawings and propose design options. Collaborate extensively with internal teams, validate design options through characterization builds, perform comprehensive DFX (Design for excellence) analysis, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), as well as Cost and UPH (unit per hour) analysis, review mechanical and electrical simulations, initiate assembly process flow, and deliver most optimized design for manufacturing with yield and quality. Ensuring build readiness, execute package qualification plan, follow up package reliability status, investigate and close failures on time. Monitor assembly and test yield on engineering/customer sample and low volume production builds. Drive yield improvement and manage excursions. Lead new product from low volume to high volume production transition with yield and quality meeting goals. Ensure FMEA, SOD, Control Plan, recipe guideline, SPC and other assembly controls are ready prior to high volume production. Lead new technology transition (new wafer tech/process/material) from engineering stage to volume production.

Qualifications

Master's degree or Above in Material Science, Polymer Science, Mechanical Engineering, or other engineering disciplines.
Proficient understanding of packaging domains such as SMT, PCB assembly, solder joint reliability, board level reliability, packaging materials, failure analysis, and PCB layout. Additional knowledge in areas like die attach, wire bond, wafer thinning, and molding is a plus.
Self-motivated and self-directed.
Strong work ethic, capable of performing effectively under high-pressure situations, and maintaining composure in the face of uncertainties.
Exceptional problem-solving skills with expertise in experimental design and statistical analysis.
Excellent communication skills, enabling collaboration with global functional teams.

MS degree with more than 6 years of relevant work experience, or PhD degree with over 3 years of work experience.

Additional Information

Western Digital thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Western Digital is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Western Digital has received reports of scams where a payment is requested on Western Digital's behalf as a condition for receiving an offer of employment. Please be aware that Western Digital and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to

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