- To lead a team of product development engineers to develop and establish assembly processes recipe for new products through process characterization and process parameters optimization.
- Drive NPI to have APQP standard of handling over to HVM in meeting all KPI & Yield.
- Drive cost saving and process Cost of Ownership (COO) improvement through material selection, process cycle time improvement, productivity improvement/innovation.
- Drive Yield & Quality KPI improvement through Lean Six Sigma approach.
- Program Management of new products' introduction.
- Sense of ownership & responsibility.
- Capable high-level reporting.
- Other duties assigned by supervisor.
- Education: Degree in Engineering (Material/Mechanical/Electrical/Electronic)/Applied Science (Physic).
- Language: English (Written & Spoken).
- Experience: Knowledge of Process Control, SPC, DOE, QC Tools, FMEA, Problem Analysis.
- Knowledge of Flip Chip PGA/BGA processes.
- Experience on creating recipe for Die Attach, Reflow oven, solder printing and chip attach will be an added advantage.
- Ability to perform temperature profile characterisation for new product introduction.
- Good knowledge on SMT line/ flip chip process control / SPC/ CPK or other advanced packing competency.
- Familiar with equipment for example Datacon die attach, Heller/ BTU reflow oven and Dek solder printing or any equivalent
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Manager, Product Development Engineering - George Town, Malaysia - Hunters International Sdn Bhd
Description
About the company:
Our client is located in Penang, Malaysia, and is one of the state-of-the-art Assembly and Test service providers for high-performance computing and communication solutions. As one of the pioneer companies in Penang, their mission is to enable their global customers' success with leading-edge and differentiated high-value packaging solutions.
Job Responsibilities:
Job Requirements:
Remuneration:
MYR 13,000 - MYR 17,000
Consultant in charge:
Shin Yoong | |